As semiconductor processes move towards smaller nanometer geometries, chips are becoming increasingly vulnerable to internal defects and external aggressions. New types of faults are appearing and existing analysis tools are reaching their limits in their capacity to predict the physical behavior of new semiconductor technologies.

 
Faults include permanent errors – defects either not detected during manufacturing or happening during field operation which permanently impact hardware – and transient faults – temporary errors caused by signal integrity issues or natural radiation (soft errors) which do not leave hardware modification, and therefore are more difficult to detect and investigate.
 
You will find in this section a quantity of material (video, papers, articles) related to transient faults, their mechanisms, the way to predict them, measure them and various industry trends.