Issam NOFAL speak on ‘Soft-Errors Analysis and Mitigation Framework’
Issam NOFAL speak on ‘Soft-Errors Analysis and Mitigation Framework’
Going to ISIS-Chiplr laboratory in UK
IROC Technologies SERTEST team will be at ISIS-ChipIr (UK).
TSMC OIP Nanjing 2023
IROC Technologies has participated in TSMC OIP Nanjing 2023.
IROC’s latest article on Semiwiki
Our latest article on Semiwiki discusses the increasing importance of Single Event Effects (SEE) in chip design, packaging, and the profound impact on product reliability and failure rates.
Radiation Hardened Electronics Technologies
JC (Jean-Charles) Bouzigues, our US West Coast VP of Sales and Business Development, will present ‘Streamlining Radiation Hardening Prior to Tape Out with IROC’s TFIT: The Trusted EDA Solution’ this Thursday November 9 at the RHET conference.
Representative US West Coast – JC
IROC Technologies, the leader in Radiation Hardening and Trusted EDA solution, is excited to appoint JC(Jean-Charles) Bouzigues, MSEE, MBA as its representative in the US.
Radiation Hardened Electronics Technologies (RHET)
IROC Technologies is excited to announce our participation in the Radiation Hardened Electronics Technologies (RHET) conference in Texas from November 6th to 9th.
LANL radiation shuttle campaign
IROC Technologies’ SERTEST team will be at Los Alamos National Laboratory (LANL) for the next 2 weeks for high-energy neutron shuttle campaign.
TSMC OIP Nanjing
IROC Technologies is thrilled to announce our participation in the upcoming TSMC OIP Ecosystem Forum taking place in Nanjing, China on November 15th.
Welcome New Team Members!
IROC Technologies is thrilled to introduce our newest employee, Harold Cortes Ordoñez.
